No rest for the wicked. Yesterday, Sunday March 27, Ming-Chi Kuo tweeted! In response to a tweet from 9to5macwhich presented a diagram of the iPhone 14 Pro and their much bulkier rear optical block, the analyst simply gives the reason for this increase.
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According to the star analyst, an expert in the future actions of Apple, this more cumbersome block is due to the fact that Tim Cook’s teams have made the decision to improve the wide-angle. The module at the heart of the photographic experience of the iPhone would thus see its sensor go from 12 Mpix to 48 Mpix.
This should allow it – again with the help of computational photography functions – to improve both sharpness and image definition. If the photos of Apple smartphones have long enjoyed excellent color rendering and very good exposure, they do however suffer from flat color processing. An approach that is especially noticeable when you enlarge an image or try to print it.
The main reason for the larger and more prominent rear-camera bump of the 14 Pro/Pro Max is upgrading the wide camera to 48MP (vs. 13 Pro/Pro Max’s 12MP). The diagonal length of 48MP CIS will increase by 25-35%, and the height of 48MP’s 7P lens will increase by 5-10%. https://t.co/lrwgmnLNce
— 郭明錤 (Ming-Chi Kuo) (@mingchikuo) March 27, 2022
Be that as it may, Ming-Chi Kuo gives an idea of the gains in size of the rear light unit. It would be 25-35% wider and 5-10% thicker. The wide-angle optics would be, as on the latest iPhone 13 Pro, composed of seven elements, made of plastic.
Back in September, it was rumored that Apple was planning to offer a design without the bump produced by the cameras on the back. With an increase in the depth of the modules, this will certainly be difficult to achieve. But Apple could still maintain the punch hole on the front to make the current notch disappear.