As astronomical demand for AI semiconductors continues to grow, NVIDIA needs advanced memory chips with high bandwidth, and lots of them. Samsung has launched some strong products to support this demand, and its focus on this segment of the semiconductor memory market could make it NVIDIA’s sole HBM3E module supplier this year.
Samsung developed 12-layer HBM3E modules
Samsung is far from the only chipmaker producing high-bandwidth memory modules. Other companies, including SK Hynix in South Korea, are also competing to secure these lucrative orders, but it appears Samsung has a good relationship with NVIDIA.
Samsung has surpassed competitors including Micron and SK Hynix by developing 12-layer HBM3E modules. This could enable the company to surpass its two rivals and take all orders from NVIDIA. While Micron announced mass production of the 8-layer HBM3E last month, Samsung came out with a 12-layer module of 36GB. Despite having a higher layer count, Samsung’s module is the same height as the 8-layer HBM3E. Its performance and capacity are 50 percent higher than that module.