Under US embargo Chinese giant Huawei, continues to challenge. As is known, the brand, which has restricted access to many Intel and Qualcomm chips, is doing wonders with its own chip. Huawei chips, which have 100 percent more memory bandwidth than their previous chips, compete with Apple M3. Here are the features of the new Kirin chips…
Huawei Chips Compete with Apple M3, Here Are the Features of the New Kirin Chips
Huawei’s new generation chip Kirin, unified memory architecture (UMA). In this respect, RAM memory, GPU and CPU are shared in Kirin chipsets, which are similar to Apple’s M series processors and Intel Core Ultra model processors. According to new rumors, the Kirin chip will achieve M3 performance.
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Huawei’s next-generation Kirin chip It is expected to be a major competitor to Apple. According to information from a Weibo user Fixed Focus Digital, it is stated that the Kirin CPU can reach the performance of the Apple M3 with the Taishan V130. The social media user, who said that the chip in question was specially designed for artificial intelligence technology terminal products, said that the memory tape of the chip was previously Huawei PC chips It is stated that it is twice as wide as the previous one.
Fixed Focus Digital, Huawei says its new processor will have higher performance than the chipsets used in Windows. To give a specific example, the new generation Kirin chip Qualcomm Snapdragon X (It is expected to compete with 45 TOPs NPU). These are the rumors about the chip in terms of performance, but there is no information yet about whether the chips will use US artificial intelligence codes.
Next-Gen Kirin Chip Comes to Stiff Competition
The new generation of Kirin chips is said to be Competition with M3 To understand whether it can do it or not, the chips need to be tested on well-known performance sites. Although these chips are a bit slower than the M3, we can say that it is a great success for Huawei to produce its own chips at this level amidst all these sanctions. Huawei is under a strict embargo.
Chinese giant Huawei Due to US sanctions, every stage of the new generation Kirin chips was completed in China. SMIC, which went through a 7nm production process, produced Kirin 9000S chipset we can show as an example. TSMC produces chips with higher technologies, but since Huawei cannot access this technology, chipsets remain in the background. In this context, we can give as an example the Ascend 910B AI chipsets, which are faced with low efficiency problems and contain errors in 80 percent of the chips.
Huawei, To compete with the best in the industry US embargoes It continues. We will see in the future whether it will be successful enough in the chip area, but it is obvious that it is extremely stable in terms of its work strategy and goals.