“The highest number of cores, the highest number of tasks and the largest amount of cache memory (ever seen) for a mobile CPU dedicated to gaming: this is what AMD announces for a future processor called Dragon Range. Powered by the same Zen 4 architecture as chips for desktop PCs (Ryzen 7000 “Raphael”) expected to launch at the end of 2022, Dragon Range will be a range of chips for laptops whose thickness will be ” greater than 20mm “. Understand here the uncompromising gaming laptops that dissipate more than 150W, an area in which Intel remains the king.
Read also: What are the FPGA processors AMD wants to spend $35 billion on? (Feb. 2022)
Who says Zen 4, says DDR5, PCI Express 5.0 and 5 nm engraving. On the heat dissipation side, the slide exfiltrated by Ian Cutress, former AnandTech journalist turned analyst, is very clear: the chip will go beyond 55W. Well above the U ranges as well as its little brother “Phoenix”, also a baby of the Zen 4 family planned for 2023, but whose thermal envelope is more contained (35-45W).
Well there we go, @AMD Dragon Range replaces the HX market, DDR5. Phoenix in the more traditional H market, LPDDR5 only. Process node not mentioned. Graphics not mentioned. $AMD pic.twitter.com/4BCYQSMe1z
— ??. ??? ??????? (@IanCutress) May 3, 2022
To widen the gap compared to Phoenix, Dragon Range will use not only low-power laptop memory (LPDDR5, where LP stands for “Low Power”), but also “real” PC DDR5. Office. Freed from the limitations imposed by this type of memory, Dragon Range should obtain more or less the same performance as fixed PC chips (at equivalent Watts).
In addition to gamers, this super chip should also appeal to creators, a portmanteau of all graphic workers (video editing, compositing, 3D modeling, etc.) who are looking for this type of performance in a machine they can carry. Because with a processor over 55W, it goes without saying that the machines will be more portable than ultraportable.
Also see video:
Also see video:
This separation into “high performance” (Phoenix) and “very high performance” (Dragon Range) chips is obviously inspired by Intel which, with its H chips, still has a wider range than AMD.
Scheduled for 2023, these chips will have to compete with Intel’s Meteor Lake chips. SoCs which will be Intel’s first “chiplet” products, with Intel 4 engraving (7 nm high density from Intel) and a graphics part engraved in 3 nm by TSMC.
Source : Ian Cutress (Twitter)